How do components fail?
Switches and pushbuttons: failure to make contact.
What you've listed looks like the severity part of an FMEA (Failure Mode and Effect Analysis), at least at component level. While it's not impossible, it's a hell of a job to account for every possible component failure if your design has, say, over a hundred components. One failing component may cause an avalanche of other components failing. Most failures aren't subtle.
You'll experience that adding components to cope with other components failing only adds complexity; you'll have to do an FMEA for these components as well!
An alternative approach, FMEA-wise, may be to start from occurrences. What's the MTTF (Mean Time To Failure)? Most components are quite robust; tens of thousands of POH (power-on hours) are feasable. (A notable weaker component is the Al elco, but even there are solutions). Anyway, an IC usually doesn't short just like that. So, while component failure may be caused by aging, most failures are caused by external factors, like overvoltage on the grid, or user error like misconnecting. Try to reduce these risks. Power spikes may be handled by overvoltage protection diodes. Misconnection can be avoided by using different connectors so that they can't be switched. Color code wires and use matching colors on connectors.
Bottom line: it may be more important to know why components fail than how they do.
PCBs: cracks in vias
The story:
my brother had one of Philips' first CD players. One time it stopped working, but when I looked into it it worked again. This happened a few times. Trying to find out about the circumstances when it happened my brother said that the last time there was a thunderstorm. A lightning strike may do bad things to electronics, though in those cases the device doesn't start working again all by itself.
One day I was discussing the problem with a colleague when the conversation was overheard by a product manager (I was working for Philips Audio at the time). PM said that only after much searching they had found the cause of this problem: the PCB was made from some cheap material (I don't recall which, it may have been FR-2) which tended to expand when there was much moisture in the air, like during a thunderstorm. As a consequence the few vias on the board would crack open. When the air became drier again the PCB's thickness returned to normal, restoring the vias. That was one reason why I couldn't find anything. Another was that touching the PCB with a multimeter's probe caused enough pressure to close the cracks (these are microcracks!).
The remedy: soldering a wire in each via. Design solution: use FR-4 for PCBs.
Like I already said in my other answer it's important to know why the vias crack; it's no good just knowing how they do.
MOSFETs: Short circuit usually (with a bang), eventually leading to open failure due to melting of device
Resistors: Almost always open circuit
Capacitors (Electrolytic): Reduction in capacitance, leakage of electrolyte, eventually leading to open circuit
Capacitors (Ceramic): Reduction in capacitance - eventually failing open, though severe over-voltage can lead to failing closed (Citation needed).
LEDs: Gradual dimming then failing open
Zeners: Fails shorted in 90% of cases but can fail open due to extreme overheating (device can split into two pieces).
Sometimes Zener become little resistive in the reverse region. When this happens some current flow before the zener voltage.